Items

Specificayion

INSPECTION

Application Devices

Leaded / BGA / CSP / QFN / MLF / BCC packages

Applicable Size

3x3 ~ 42x42

Inspecton Items

2D : Span, Spread, Skew, Pitch, Offset, Width, Quality, Burr - etc

3D : Coplanarity, Stand off, Warpage, Total Height

Marking : Orientation, Unusual Marking Condition

PVI : Package Crack, Chip-Out, Void, Pitted Surface, Bubbles, Incomplete Fill, Delamination, Gate Remain, Mismatch, Package
Warpage, Heat Sink Deformation, Damages Solder Ball and etc.

Side Defect : Crack, Slant Out, Bus Line, Side Void, Package Gap

Hardware  

UPH

20,000 over (based on 9x9 BGA package - Tray to Tray base)

Accuracy

GR&R: Max. 5% (Golden Device)

R&R: Max. 1% (Golden Device)

Features

3D Inspection Module: Top View & Gentry Type

Camera

Area Scan

PC

Window XP based on PC to PC Interface

Hanlder Type

In Tray/Tube/Tape&Reel Type Handler

In/Output Type

Tray/Tube to Tray/Tube/Tape&Reel

Features

Good / Reject Buffer Station

Software  

Illumination

2D/ 3D/ PVI : LED Strobe Light

Features

Calibration : Manual Calibration Tool Loading Method, Golden Unit

Layout

Size(mm) & Weight(Kg)

(1,650)W x (1,600)L x (1,700)H / (1,500) Kg