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Wafer
Edge Inspection
System
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Wafer Edge inspection
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- Edge
Exclusion
defect
inspection
- Edge
Bevel
Inspection
:
Cracks,
Chip-outs,
Contamination,
- Layering
Delamination
-
EEW
/
EBR
metrology
:
inspect
from
Wafer
edge
normal
line
to
EBR
line
-
Chip
/
Crack
:
inspect
on
Top
bevel
&
bottom
bevel,
Edge
normal
line
-
Contamination
/
Particles
:
inspect
on
Wafer
bevel
or
Edge
exclusion
area
-
Delamination
:
inspect
for
layer
peeling-off
from
Wafer
edge
Top
or
Bottom
bevel
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- Edge
Top
:
Image
grabbing
with
Darkfield
illumination
at
the
exact
location
of
image
gribbing
with
Brightfield
illumination
from
1st
cycle
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- Edge
Normal
Image
grabbing
at
Bevel
side
with
Darkfield
type
illumination
which
have
:
1)
Prevention
of
beam
gathering
at
one
spot
2)
Maintenance
of
lighting
uniformity
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