⒏RTS Vision⒑

Overview

This cutting machine is applied to cut ceramic chip like MLCC/MLCI for dividing. Using machine vision for high
performance alignment, this system can guarantee the high accuracy on cutting and install Loader/Unloader as an
option for improving productivity and stability. The cuttable size of ceramic bar is 100mm ~ 160mm.

Features

High Speed cutting : 6 times a second for continuous cutting without alignment
High Precision Alignment Function : Auto-Alignment using high performance of machine vision
High Precision Cutting : Able to change the cutting points by C5 grade’s mobile spindle
Convenient Blade Exchange : Simple design makes the blade exchange done easily in short time
Easy to Use : User friendly S/W interface offers easy operation environment and quick to seize
the processing status

Product Images

Specifications

Items	Contents
Ceramic Size	100mm-160mm,
Ceramic Thickness	0~3 mm
Cutting Stage Shift Precision	Y axis：±0.01mm / Z axis：±0.01 mm / ト axis：±0.001 °
Image Process Precision	±0.009 mm
Cutting Knife (LWT)	1.16322.54mil
Cutting Speed (shift 1mm Each Time)	6 cuts/sec (No alignment)1.2 cut/sec (With Alignment)
Vacuum suction method	Produced by vacuum pump, independent space with fine heat spread
Knife Heating Range	Room temp. ~ 100∩, constant temp. SCR control, 400W
Cutting Stage Heating Range	Room temp. ~ 200∩, constant temp. SCR control, 400W
Alignment Method	Both side CCD image alignment
Light Sources Alignment	Coaxial LED light source
CCD Position	Automatic searching, back and forth, various angles, speed it up.
CCD Image Capture	Graphic human-machine interface
Marking Detection Position	Lateral or upper side allowable, single layer can’t form lateral side
Status Lamp	LED red-yellow-green 3 color lamps
Operation Interface	Graphic human-machine interface
Operation Language Support	Information & functions with Korean, Chinese and English supported
Power Requirement	AC 3フ 220V 50 /60Hz with UPS